Curing Ovens for Potting Compound Curing

In printed circuit assembly, potting is a process of filling a completed electronic assembly with a solid compound for resistance to vibration and shock, and for protection from moisture and corrosion. Thermoset encapsulating plastics are often used. Most circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. Conformal coating gives most of the benefits of potting compounds while being easier to test or repair. Potting Compounds are sometimes selected for their thermally conductive properties.

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